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Back of the Envelope Thermal Analysis
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USArmyResearchLab/ParaPower
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ARL ParaPower This program is designed to facilitate the design of power electronic modules through the use of low fidelity stress and thermal modeling tools. This software was initially conceived and written by the US Army Research Laboratory. It is being released under the Apache 2.0 license. Due to multiple authorship various portions of this software may be covered by different distribution licenses. Sections of this code that fall under a different distribution license will be marked as such within the relevant files. To execute the software, enter MATLAB and run the ParaPowerGUI.m script from the ARL_ParaPower directory. Please include a reference to this software (ARL ParaPower) in any documented research in which it is utilized. This should be accomplished by including the GITHUB URL for ARL ParaPower (https://github.com/USArmyResearchLab/ParaPower). Documentation for the software is contained in the "GUI Documentation" directory. This software has had many contributors including (alphabetical) Morris Berman (US Army Research Laboratory) Dr. Lauren Boteler (US Army Research Laboratory) Michael Deckard (Texas A&M University) Dr. Michael Fish (Postdoc at Army Research Laboratory) Dr. Steven Miner (US Naval Academy) Michael Rego (Drexel University) Dr. Andrew Smith (US Naval Academy) Justin Wang The following developers have directly contributed to the current code base: Dr. Lauren Boteler (US Army Research Laboratory) Morris Berman (US Army Research Laboratory) Dr. Steven Miner (US Naval Academy) Dr. Michael Fish (Postdoc at Army Research Laboratory) Trinity Cheng Questions/comments/issues can be directed to the "Issues" forum on the GITHUB. We welcome additional collaborators to add additional functionality.
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